PRESS RELEASES
| Date | Title |
| 04/23/10 | |
| 01/26/10 | |
| 01/12/10 | |
| 11/05/09 | |
| 09/18/09 | |
| 07/31/09 | |
| 06/10/09 | |
| 04/14/09 | |
| 04/10/09 | |
ARTICLES
June 2010 - PC/104:
Right Sizing Your Embedded Application
The ADLGS45PC is a powerhouse in the PC/104 form factor. With the myriad of “COTS embedded” based products
available, it can be difficult to come to a decision as to what type of embedded product is right for your application.
Narrowing the field of possibilities can be costly and time consuming. How do you determine which product best fits
your application requirements? Which products will give you the most flexibility? What about space constraints and
environmental factors like extreme hot and cold temperatures? What kind of airflow or lack thereof will be available
for cooling? What is your power budget? These are all very important questions that must be answered in order to
make your project a success. Read more…
April 2010 RTC Magazine – Advances in Small Form Factors
Bigger Jobs in the Same Space
The increase in CPU power, memory and interconnect bandwidth in step with Moore’s Law and implemented as PCIe/104, continues to multiply the computing power within the PC/104 form factor. And this one still has room to grow. Read more…
March 2010 - PC/104 and Small Form Factors Resource Guide
Shrinking Dies and Cooling PC/104
As die sizes shrink, engineers are looking for inventive ways of getting the heat out while maintaining the integrity of PC/104 specifications. Read more…
Active RFID Tracking System maker RF*IDI uses Advanced Digital Logic's MPC-40A as a key component in their SmartReader architecture
The MCP-40A serves as an unattended, wireless internet-connected computing platform for RF*IDI-developed software that filters and translates active RFID reader data into a customized local database tailored to a client's business model.
Read more...
Cooling takes on smaller forms
By Martin Mayer, Advanced Digital Logic
Published in PC/104 and smallformfactors: The Journal of Modular Embedded Design, Fall 2006
Passive cooling techniques fall short of doing the job for today's high-performance processors in small form factor systems. By deploying more advanced techniques, fast processors can be kept cool with cool-bearing fan sinks, improved sealing technology, and flexible heat pipes. Martin discusses the technology behind these approaches and their benefits.
See complete article (PDF)
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Events Calendar
RTECC Show
Austin, TX
RTECC Show
Dallas, TX
ESC, Boston
Booth 912
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