Thermal Solutions

Designing successful embedded systems demands efficient PCB design, choosing low power and long life components, and the creation of an effective cooling solution within the parameters specified. While heat reduces the life of systems, efficient cooling solutions directly result in long-term reliability. Often, innovative solutions to heat-dissipation issues will create an improved operational envelope and lower total cost of ownership for those systems. Simply put, a successful cooling solution meets or exceeds the performance goals of the OEM's design.

Standard heat conductive solutions typically use a flat mass of thermally conductive material, such as aluminum or copper, placed in direct contact with the processor / chipset and the interior wall of the metal enclosure. The conductive solution wicks the heat from the chips and transfers it to the case of the system where the heat is allowed to radiate out of the enclosure.

Standard convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor/chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink. In many cases convective solutions can also be used within sealed environments where the air is circulated.

ADL offers highly effective heat conductive and heat convective thermal solutions tailored to maximize the longevity of your ADL product. Whether you need a convective or conductive solution, our thermal solution designs are sure to meet the demands of your extended temperature requirements.

Whether a customer orders our embedded industrial single board computers, or has a custom design, we can develop a thermal solution that meets your requirements. Please contact your Sales Engineer for more information at or 858.490.0597.