The ADLQ570CE features 11th generation Intel® CoreTM processors and is designed to be backward compatible with legacy ADLQ170CE and ADL PCIe/104 Intel® CoreTM SBCs with respect to cabling, power supplies and compatible COTS enclosures like the ADLMES9200.
The ADLQ570CE is designed for rugged use and wide temperature operation with optional conformal coatings, underfill and bonding adhesives.
ADL specializes in rugged embedded system design. Our engineers are well-versed at creating custom embedded solutions from board level or PCIe/104 stack to full turnkey rugged systems for a wide variety of rugged military and industrial applications.
| FEATURES | DESCRIPTION |
| 11th Generation Intel® Core™ Processors Formerly codenamed Tiger Lake | Intel® Xeon® W-11865MRE: Octa (8), 2.6/4.7 GHz, 24 MB, 45W/35W TDP, Intel® UHD 32 Graphics Intel® Xeon® W-11555MRE: Hexa (6), 2.6/4.5 GHz, 12 MB, 45W/35W TDP, Intel® UHD 32 Graphics Intel® Xeon® W-11155MRE: Octa (4), 2.4/4.4 GHz, 8 MB, 45W/35W TDP, Intel® UHD 16 Graphics |
| DRAM | 3 Sockets, up to 32GB DDR4 each for total of up to 96GB DDR4, 3200 MT/s memory |
| Ethernet | 1x Intel® i226 GbE LAN Controller 1x Intel® i210 GbE LAN Controller |
| Audio | Digital High Definition Audio Interface with support for multiple audio codecs |
| Board Controller | Non-volatile User Data Storage, Board Information and Statistics, BIOS Setup Data Backup |
| Watchdog | Multi Stage Watchdog via BIOS |
| Security | TPM 2.0, SPI Infineon SLB9670 (requires RTC battery) |
| PCIe/104 Expansion | PCIe/104 downstacking interface: 4x Gen3 PCIeX1, 1x Gen4 PCIeX16 with 2x PCIeX8 Bifurcation option. |
| Expansion | 1x minicard socket for mPCIe or mSATA modules |
| USB | 8x USB 2.0 pinned; 1x USB 3.0 |
| SATA | 2x SATA III @ 6 Gb/s |
| Display | 1x VGA/DVI/HDMI 1x DisplayPort |
| Serial COM | 2x RS232/422/485 COM ports pinned |
| Other I/O | System Connector 16bit GPIO |
| Power | ATX-Compliant; ACPI 4.0 with battery support |
| Dimensions | 125 mm x 115.6 mm |
| Temperature Range | 0C to 70C Standard. Optional screening for -40C to 85C |
*Data subject to change without notice.
| ITEM CODE | PART # | DESCRIPTION |
| CPU Assembly | ||
| ADLQ570CE/W-11865MRE | 297252 | Intel® Xeon® W-11865MRE, 8C/16T, 2.6GHz / 4.7GHz, 45W/35W TDP, Passmark 15958 |
| ADLQ570CE/W-11555MRE | 297254 | Intel® Xeon® W-11555MRE, 6C/12T, 2.6GHz / 4.5GHz, 45W/35W TDP, Passmark 12591 |
| ADLQ570CE/W-11155MRE | 297256 | Intel® Xeon® W-11155MRE, 4C/8T, 2.4GHz / 4.4GHz, 45W/35W TDP, Passmark 8502 |
| Memory | ||
| 16GB DDR4 | 997616 | DDR4-DRAM 16GB, 3200MHz, Ext Temp |
| 32GB DDR4 | 997618 | DDR4-DRAM 32GB, 3200MHz-EX, Ext Temp |
| Options and Accessories | ||
| ADL-ET | 290000 | Extended Temp Screen (-40º to +85º C) |
| UNDERFILL | 807707 | BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp |
| COATING | 807706 | Conformal Coating |
| UNDERFILL / BONDING | 807709 | Underfilling, Bonding, and Conformal Coating |
| ADLQ170CE Cable Kit | 292770 | ADLQ170CE/ADLQM87PC Cable Kit |
| ADLQ570CE-Spreader | 294873 | Copper-Enhanced Heat Spreader |
*Data subject to change without notice.
