Spring 2018 Issue, Embedded Intel® Solutions Magazine – A Nice Head Start: Q&A with JC Ramirez, ADL Embedded Solutions
Surviving The Embedded Design Thermo-Mechanical Envelope
The Embedded usage model is characterized as one that is operated at the extremes of available performance. Knowing that the targets of the thermal design power usage mode are only partially applicable, embedded designers must satisfy the customers’ innate desires for maximum throughput and level of service at the edges of a constrained thermo- mechanical environment.
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