ADLQ170HDS

Product Features

  • 6th Generation Intel® Core™ i3 / i7
  • Intel® Q170 Chipset
  • Firmware TPM 2.0 (fTPM)
  • Up to 32GB DDR4-2133
  • 4x USB 3.0; IPEX-USB 3.0
  • MTBF > 250,000 hours
  • 4x SATA 6 Gb/s
  • 4x PCie X1 Expansion Lanes
  • Operating Temperature -20C to 70C; Optional -40C to 85C
  • Windows and Linux Compatible with Full Driver Support

The ADLQ170HDS is the latest in ADL’s line of high-performance 3.5” Intel® Core™ single board computers (SBC). It makes use of 6th generation Intel Core Skylake processors and Intel’s Q170 chipset to provide a robust set of features including 32 GB DDR4 DRAM, 4x SATA 6Gb/s, 4x USB 3.0 and much more.

This makes it ideal for a variety of system-critical industrial applications where these high-performance features are an absolute necessity, but no less critical are less tangible features like high MTBF, long-life availability, hardware and firmware revision control, obsolescence management, technical, engineering and design support.

Applications

Intelligent PC controller for factory automation machinery and equipment, High-Speed Industrial Storage, Very-High/Ultra-High USB 3.0 Vision Processor, Industrial Data Aggregation and Storage, Industrial IoT Gateways and Controllers, Secure Networking Devices, Mobile Telephony, Traffic EngineeringTransportation, Wind Turbine Datalogging and Collision Avoidance, Drone Payload Computing, Oil and Gas IPC and Unmanned Autonomous Systems.

CPU

Item Codes Part# Description
ADLQ170HDS-6700TE 294900 6th Generation Intel® Core™ i7 2.4GHz 4C, 8MB
ADLQ170HDS-6100TE 294902 6th Generation Intel® Core™ i3 2.7GHz 2C, 3MB

Memory

Item Codes Part# Description
DDR4-2133-8GB 997610 DDR4-2133 MHz 8GB Standard Temperature
DDR4–2133-16GB 997611 DDR4-2133 MHz 16GB Standard Temperature
DDR4-2133-8GB-EX 997612 DDR4-2133 MHz 8GB Extended Temperature
DDR4-2133-16GB-EX 997614 DDR4-2133 MHz 16GB Extended Temperature

Board Options

Item Codes Part# Description
ADLQ170HDS-SPREADER 294866 0.400” Copper / Aluminum Heat Spreader
Coating, Underfill & Bonding 807709 Conformal Coating of CPU board, Underfill of BGA components and Bonding of high mass components
ADL-ET 290000 Extended Temperature Screening (–40C to +85C)
Data subject to change without notice

Need More Information?

Email a Sales Engineer at sales@adl-usa.com or call toll-free 855-727-4200 for product information, model numbers and pricing. A Sales Engineer can be reached by phone and email, Monday – Friday, Pacific Time, 7 a.m. – 5 p.m.

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